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Water-based solution processing and wafer-scale integration of all-graphene humidity sensors

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journal contribution
posted on 2025-08-01, 00:33 authored by E Torres Alonso, D-W Shin, G Rajan, A Neves, S Russo, MF Craciun
One of the main advantages of 2D materials for various applications is that they can be prepared in form of water-based solutions. The high yield and cost-effectiveness of this method makes them of great interest for printed electronics, composites, bio and healthcare technologies. However, once deposited on a substrate, etching away these solution-processed materials is a difficult task, yet crucial for pattern definition and thus device fabrication. In particular, the realization of micron-size patterns requires mesh and paste optimization when screen-printed or solvent-engineering and surface functionalization when inkjet-printed, both usually involving additional post-deposition steps. These constrains are holding back the integration of these 2D materials in devices and applications. In this work, a novel method for the fabrication of micron-size welldefined patterns in water-based 2D materials, is presented, with an extensive characterization of the films and patterns obtained. The method was ultimately used to create humidity sensors with performance comparable to that of commercial ones. These sensor devices were fabricated onto a 4’ silicon and PET wafers to create allgraphene humidity sensors that are flexible, transparent, and compatible with current CMOS and roll-to-roll workflows.

Funding

EP/K010050/1

EP/K017160/1

EP/M001024/1

EP/M002438/1

Engineering and Physical Sciences Research Council (EPSRC)

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Rights

© 2019 The Authors. Published by WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim. This is an open access article under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/4.0/), which permits use, distribution and reproduction in any medium, provided the original work is properly cited.

Notes

This is the final version. Available from Wiley via the DOI in this record.

Journal

Advanced Science

Publisher

Wiley

Version

  • Version of Record

Language

en

FCD date

2019-05-14T15:47:25Z

FOA date

2019-05-29T10:50:15Z

Citation

Published online 28 May 2019.

Department

  • Engineering

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