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dc.contributor.authorMcGuigan, M
dc.contributor.authorChristmas, J
dc.date.accessioned2020-10-06T14:25:45Z
dc.date.issued2020-09-28
dc.description.abstractLatent fingerprints are the kind left on objects after direct contact with a person’s finger, often unwittingly at crime scenes. Most current techniques for extracting these types of fingerprint are invasive and involve contaminating the fingerprint with chemicals which often renders the fingerprint unusable for further forensic testing. We propose a novel and robust method for extracting latent fingerprints from surfaces without the addition of contaminants or chemicals to the evidence. We show our technique works on notoriously difficult to image surfaces, using off-the-shelf cameras and statistical analysis. In particular, we extract images of latent fingerprints from surfaces which are transparent, curved and specular such as glass lightbulbs and jars, which are challenging due to the curvature of the surface. Our method produces results comparable to more invasive methods and leaves the fingerprint sample unaffected for further forensic analysis. Our technique uses machine learning to identify partial fingerprints between successive images and mosaics them.en_GB
dc.identifier.citation2020 International Joint Conference on Neural Networks (IJCNN), 19-24 July 2020, Glasgow, Scotlanden_GB
dc.identifier.doi10.1109/ijcnn48605.2020.9207376
dc.identifier.urihttp://hdl.handle.net/10871/123119
dc.language.isoenen_GB
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_GB
dc.rights© 2020 IEEE. All rights reserveden_GB
dc.subjectSurface treatmenten_GB
dc.subjectFeature extractionen_GB
dc.subjectForensicsen_GB
dc.subjectLightingen_GB
dc.subjectOptical surface wavesen_GB
dc.subjectCamerasen_GB
dc.subjectContactless fingerprint extractionen_GB
dc.subjectneural networken_GB
dc.titleRemote Extraction of Latent Fingerprints (RELF)en_GB
dc.typeConference paperen_GB
dc.date.available2020-10-06T14:25:45Z
dc.identifier.isbn978-1-7281-6926-2
dc.descriptionThis is the author accepted manuscript. The final version is available from IEEE via the DOI in this recorden_GB
dc.identifier.eissn2161-4407
dc.rights.urihttp://www.rioxx.net/licenses/all-rights-reserveden_GB
rioxxterms.versionAMen_GB
rioxxterms.licenseref.startdate2020-09-28
rioxxterms.typeConference Paper/Proceeding/Abstracten_GB
refterms.dateFCD2020-10-06T14:22:21Z
refterms.versionFCDAM
refterms.dateFOA2020-10-06T14:25:48Z
refterms.panelBen_GB


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