Perceiving the temperature coefficients of carbon-based perovskite solar cells
Bhandari, S; Roy, A; Ghosh, A; et al.Mallick, T; Sundaram, S
Date: 19 October 2020
Journal
Sustainable Energy and Fuels
Publisher
Royal Society of Chemistry
Publisher DOI
Abstract
Perovskite solar cells (PSCs) have emerged in a "catfish effect" of other established
photovoltaic technologies with the rapid development of high-power conversion efficiency
(PCE) and low-cost fabrication. Among various kinds of PSCs, the organic hole transport layer
(HTL) free carbon‐based PSCs (c‐PSCs) has appeared as the most ...
Perovskite solar cells (PSCs) have emerged in a "catfish effect" of other established
photovoltaic technologies with the rapid development of high-power conversion efficiency
(PCE) and low-cost fabrication. Among various kinds of PSCs, the organic hole transport layer
(HTL) free carbon‐based PSCs (c‐PSCs) has appeared as the most promising devices due to its
excellent stability. However, temperature becomes one of the crucial factors in determining the
pace of PSCs commercialization. Temperature stress at the interfaces between the perovskite
film and the charge transport layers is an essential factor in determining the performance of cPSCs. This work assesses the correlation between the temperature coefficients (TC) and
different photovoltaic parameters for HTL free c-PSCs. To evaluate different photovoltaic
parameters of the c-PSC as a function of temperature, two different testing approaches such as
steady temperature (ST) and transient temperature (TT) conditions have been considered across
a wide range of temperature window (5-75 oC) under 1 SUN 1.5 AM. Here the TT testing stands
for a single c-PSC undergoing a continuous temperature treatment whereas; the ST testing
indicates specific temperature treatment for an individual c-PSC. The maximum efficiency
achieved at 25 oC for TT testing devices is ~14.5%, which is ~11% higher than the ST testing
devices (PCE ~13%). Moreover, the efficiency temperature coefficient (ETC) for ST testing
was found 3.5 x 10-2 (5 °C ≤ T ≤ 25 °C) and -2.1 x 10-2 (25 °C ≤ T ≤ 75 °C), whereas the ETC
values of TT testing devices were +2.5 x 10-2 (5 °C ≤ T ≤ 25 °C) and -1.8 x 10-2 (25 °C ≤ T ≤
75 °C), respectively. The outcome of the temperature stress transmitting through different
interfacial layers was further investigated by the thermal imaging for TT devices. On the other
hand, X-ray diffraction and scanning electron microscope structural analysis were
demonstrated to understand the thermal stress on the overall performance of ST devices. It has
been observed that the TC values resulting from TT testing condition are reversible, whereas in
the case of ST testing shows irreversible nature and facilitates degradation of the device.
Engineering
Faculty of Environment, Science and Economy
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