Electrical/thermal behaviors of bimetallic (Ag–Cu, Ag–Sn) nanoparticles for printed electronics

Abstract

In this work, Ag–Cu and Ag–Sn nanoparticles (NPs) were synthesized by a physical vapor condensation method, i.e. DC arc-discharge plasma. The as-prepared bimetallic NPs consist of metallic cores of Ag–Cu or Ag–Sn and ultrathin oxide shells of CuO or a hybrid of SnO and SnO2. Ag–Sn NPs exhibit a room-temperature resistivity of 4.24 × 10−5 Ω · cm, a little lower than 7.10 × 10−5 Ω · cm of Ag–Cu NPs. Both bimetallic NPs demonstrate typical metallic conduction behavior with a positive temperature coefficient of resistance over 25–300 K. Ag–Sn NPs exhibit thermally competitive stability up to 230 °C and a lower resistivity of 3.18 × 10−5 Ω · cm after sintering at 200 °C, giving it potential for application in flexible printed electronics.