dc.contributor.author | Li, Qiang | |
dc.contributor.author | Kuang, Y | |
dc.contributor.author | Zhu, M | |
dc.date.accessioned | 2017-01-10T12:11:31Z | |
dc.date.issued | 2017-01-20 | |
dc.description.abstract | This letter presents a piezoelectric bimorph with auxetic (negative Poisson’s ratio) behaviors for
increased power output in vibration energy harvesting. The piezoelectric bimorph comprises a 2D auxetic
substrate sandwiched between two piezoelectric layers. The auxetic substrate is capable of introducing auxetic
behaviors and thus increasing the transverse stress in the piezoelectric layers when the bimorph is subjected to a
longitudinal stretching load. As a result, both 31- and 32-modes are simultaneously exploited to generate electric
power, leading to an increased power output. The increasing power output principle was theoretically analyzed
and verified by finite element (FE) modelling. The FE modelling results showed that the auxetic substrate can
increase the transverse stress of a bimorph by 16.7 times. The average power generated by the auxetic bimorph is
2.76 times of that generated by a conventional bimorph. | en_GB |
dc.description.sponsorship | The authors gratefully acknowledge financial support from the Engineering and Physical Sciences Research
Council (EPSRC) in the UK through the grant EP/K020331/1. | en_GB |
dc.identifier.citation | Vol. 7, Iss. 1 | en_GB |
dc.identifier.doi | http://dx.doi.org/10.1063/1.4974310 | |
dc.identifier.uri | http://hdl.handle.net/10871/25138 | |
dc.language.iso | en | en_GB |
dc.publisher | American Institute of Physics | en_GB |
dc.rights | © 2017 Author(s). All article content, except where
otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license
(http://creativecommons.org/licenses/by/4.0/). [http://dx.doi.org/10.1063/1.4974310] | |
dc.title | Auxetic piezoelectric energy harvesters for increased electric power output | en_GB |
dc.type | Article | en_GB |
dc.identifier.issn | 2158-3226 | |
dc.description | This is the author accepted manuscript. The final version is available from AIP Publishing via the DOI in this record. | |
dc.identifier.journal | AIP Advances | en_GB |