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dc.contributor.authorLi, Qiang
dc.contributor.authorKuang, Yang
dc.contributor.authorZhu, Meiling
dc.date.accessioned2017-01-23T13:57:09Z
dc.date.issued2016
dc.description.abstract— There is a lack of system-level finite element (FE) model which can directly predict the performance of a piezoelectric energy harvester connected with interface circuits and electric load. This work developed a system-level model of piezoelectric strain energy harvesting system by directly coupling the finite element and electrical circuits. The strain energy harvester (SEH) is a macro fibber composite adhesively bonded to a composite beam. Simulations were performed with the SEH connected with three circuits individually (i) a load resistor, (ii) a rectifier terminated with a load resistor and (iii) a rectifier terminated with a smoothing capacitor and a load resistor. Experimental tests were carried out to validate the simulation results. Good agreements were observed between the simulated and measured results. The developed model is able to predict the performance of the energy harvesting system when different circuit was connected. The validated system-level model can be used for the design and optimization of piezoelectric energy harvesting system by investigating the interactions between energy harvester and electrical circuits.en_GB
dc.identifier.citationDOI: 10.1109/ICSENS.2016.7808754en_GB
dc.identifier.doi10.1109/ICSENS.2016.7808754
dc.identifier.urihttp://hdl.handle.net/10871/25347
dc.language.isoenen_GB
dc.publisherInstitute of Electrical and Electronics Engineers (IEEE)en_GB
dc.subjectsystem-level modellingen_GB
dc.subjectpiezoelectric energy harvestingen_GB
dc.subjectFinite Element Analysisen_GB
dc.subjectmacro fibber compositeen_GB
dc.titleSystem-level modelling and validation of a strain energy harvesting system by directly coupling finite element and electrical circuitsen_GB
dc.typeConference paperen_GB
dc.date.available2017-01-23T13:57:09Z
dc.identifier.isbn978-1-4799-8287-5
dc.descriptionThis is the author accepted manuscript. The final version is available from the publisher via the DOI in this record.en_GB
dc.identifier.journalSENSORS, 2016 IEEE. 30 Oct.-3 Nov. 2016en_GB


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