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dc.contributor.authorIslam, N
dc.date.accessioned2017-03-07T13:00:13Z
dc.date.accessioned2018-05-21T09:18:10Z
dc.date.issued2017-04-14
dc.description.abstractThe paper develops an integrated technology-push and market-pull framework, and a value chain model for crossing the Valley of Death (VOD-the gap between laboratory and market) for emerging technologies, based on primary and secondary data analyses and a survey conducted on European research and development projects. The study uses a case of micro and nanomanufacturing technology (MNT) and confirms the existence of the VOD through the survey data analysis. A mixed-methods approach was adopted which investigated the business and technical challenges to the commercialization of MNT. A notable finding is that the emerging MNT often does not have a direct link with market demand and the result suggests that an intermediary role between advanced technology and market demand should be integrated to act as coordinator for overcoming the VOD. The paper also examines how an intermediary is crucial to escape the VOD, within the value chain of the interdependent relationships between actors.en_GB
dc.identifier.citationVol. 64 (3), pp. 389-399en_GB
dc.identifier.doi10.1109/TEM.2017.2685138
dc.identifier.urihttp://hdl.handle.net/10871/32937
dc.language.isoenen_GB
dc.publisherInstitute of Electrical and Electronics Engineersen_GB
dc.rights© 2017 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other users, including reprinting/ republishing this material for advertising or promotional purposes, creating new collective works for resale or redistribution to servers or lists, or reuse of any copyrighted components of this work in other works.en_GB
dc.subjectTechnological innovationen_GB
dc.subjectManufacturingen_GB
dc.subjectBusinessen_GB
dc.subjectCommercializationen_GB
dc.subjectEuropeen_GB
dc.subjectSystematicsen_GB
dc.subjectContexten_GB
dc.titleCrossing the Valley of Death - An integrated framework and a value chain for emerging technologiesen_GB
dc.typeArticleen_GB
dc.date.available2018-05-21T09:18:10Z
dc.identifier.issn0018-9391
pubs.declined2017-03-08T10:15:41.461+0000
dc.descriptionThis is the author accepted manuscript. The final version is available from Institute of Electrical and Electronics Engineers (IEEE) via the DOI in this record.en_GB
dc.identifier.journalIEEE Transactions on Engineering Managementen_GB


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