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dc.contributor.authorChen, J
dc.contributor.authorFonseca, MA
dc.contributor.authorHeyes, A
dc.contributor.authorYang, J
dc.contributor.authorZhang, X
dc.date.accessioned2023-08-18T08:22:17Z
dc.date.issued2023-08-30
dc.date.updated2023-08-17T15:19:02Z
dc.description.abstractThe frequency of hot days in much of the world is increasing. What is the impact of high temperatures on productivity? Can technology-based adaptation mitigate such effects of climate change? We provide some answers to these questions by examining how high outdoor temperatures affect a high-technology, precision manufacturing setting. Exploiting individual-level data on the quantity and quality of work done across 35,190 worker-shifts in a leading NYSE-listed silicon wafer maker in China, we evidence a negative effect of outdoor heat on productivity. The effects are large: in our preferred linear specification, an increase in wet bulb temperature of 10◦C causes a reduction in output of 8.3%. Temperature effects exist even though the manufacturer’s work-spaces are indoors and protected by high-quality climate control systems. Results are not driven by extreme weather events and are robust to alternative modelling approaches. They illustrate the potential future adverse economic effects of climate change in most of the industrialised world.en_GB
dc.description.sponsorshipSocial Sciences and Humanities Research Council of Canada SSHRC Insight Granten_GB
dc.description.sponsorshipNational Natural Science Foundation of Chinaen_GB
dc.description.sponsorshipCanada Research Chair (CRC) Programmeen_GB
dc.identifier.citationPublished online 30 August 2023en_GB
dc.identifier.doi10.1007/s10640-023-00803-4
dc.identifier.grantnumber435-2020-0100en_GB
dc.identifier.grantnumber71762013en_GB
dc.identifier.urihttp://hdl.handle.net/10871/133803
dc.identifierORCID: 0000-0002-5294-6784 (Fonseca, Miguel Alexandre)
dc.language.isoenen_GB
dc.publisherSpringeren_GB
dc.rights© The Author(s) 2023. Open Access. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Com mons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/
dc.subjectClimate impactsen_GB
dc.subjectAdaptationen_GB
dc.subjectProductivityen_GB
dc.titleHow much will climate change reduce productivity in a high-technology supply chain? Evidence from silicon wafer manufacturingen_GB
dc.typeArticleen_GB
dc.date.available2023-08-18T08:22:17Z
dc.identifier.issn0924-6460
dc.descriptionThis is the final version. Available on open access from Springer via the DOI in this recorden_GB
dc.identifier.eissn1573-1502
dc.identifier.journalEnvironmental and Resource Economicsen_GB
dc.rights.urihttps://creativecommons.org/licenses/by/4.0/en_GB
dcterms.dateAccepted2023-08-10
dcterms.dateSubmitted2022-10-04
rioxxterms.versionVoRen_GB
rioxxterms.licenseref.startdate2023-08-10
rioxxterms.typeJournal Article/Reviewen_GB
refterms.dateFCD2023-08-17T15:19:04Z
refterms.versionFCDAM
refterms.dateFOA2023-09-28T14:31:54Z
refterms.panelCen_GB


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© The Author(s) 2023. Open Access. This article is licensed under a Creative Commons Attribution 4.0 International License, 
which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long 
as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Com mons licence, and indicate if changes were made. The images or other third party material in this article 
are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the 
material. If material is not included in the article’s Creative Commons licence and your intended use is not 
permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly 
from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/
Except where otherwise noted, this item's licence is described as © The Author(s) 2023. Open Access. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Com mons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/