How much will climate change reduce productivity in a high-technology supply chain? Evidence from silicon wafer manufacturing
dc.contributor.author | Chen, J | |
dc.contributor.author | Fonseca, MA | |
dc.contributor.author | Heyes, A | |
dc.contributor.author | Yang, J | |
dc.contributor.author | Zhang, X | |
dc.date.accessioned | 2023-08-18T08:22:17Z | |
dc.date.issued | 2023-08-30 | |
dc.date.updated | 2023-08-17T15:19:02Z | |
dc.description.abstract | The frequency of hot days in much of the world is increasing. What is the impact of high temperatures on productivity? Can technology-based adaptation mitigate such effects of climate change? We provide some answers to these questions by examining how high outdoor temperatures affect a high-technology, precision manufacturing setting. Exploiting individual-level data on the quantity and quality of work done across 35,190 worker-shifts in a leading NYSE-listed silicon wafer maker in China, we evidence a negative effect of outdoor heat on productivity. The effects are large: in our preferred linear specification, an increase in wet bulb temperature of 10◦C causes a reduction in output of 8.3%. Temperature effects exist even though the manufacturer’s work-spaces are indoors and protected by high-quality climate control systems. Results are not driven by extreme weather events and are robust to alternative modelling approaches. They illustrate the potential future adverse economic effects of climate change in most of the industrialised world. | en_GB |
dc.description.sponsorship | Social Sciences and Humanities Research Council of Canada SSHRC Insight Grant | en_GB |
dc.description.sponsorship | National Natural Science Foundation of China | en_GB |
dc.description.sponsorship | Canada Research Chair (CRC) Programme | en_GB |
dc.identifier.citation | Published online 30 August 2023 | en_GB |
dc.identifier.doi | 10.1007/s10640-023-00803-4 | |
dc.identifier.grantnumber | 435-2020-0100 | en_GB |
dc.identifier.grantnumber | 71762013 | en_GB |
dc.identifier.uri | http://hdl.handle.net/10871/133803 | |
dc.identifier | ORCID: 0000-0002-5294-6784 (Fonseca, Miguel Alexandre) | |
dc.language.iso | en | en_GB |
dc.publisher | Springer | en_GB |
dc.rights | © The Author(s) 2023. Open Access. This article is licensed under a Creative Commons Attribution 4.0 International License, which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Com mons licence, and indicate if changes were made. The images or other third party material in this article are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the material. If material is not included in the article’s Creative Commons licence and your intended use is not permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/ | |
dc.subject | Climate impacts | en_GB |
dc.subject | Adaptation | en_GB |
dc.subject | Productivity | en_GB |
dc.title | How much will climate change reduce productivity in a high-technology supply chain? Evidence from silicon wafer manufacturing | en_GB |
dc.type | Article | en_GB |
dc.date.available | 2023-08-18T08:22:17Z | |
dc.identifier.issn | 0924-6460 | |
dc.description | This is the final version. Available on open access from Springer via the DOI in this record | en_GB |
dc.identifier.eissn | 1573-1502 | |
dc.identifier.journal | Environmental and Resource Economics | en_GB |
dc.rights.uri | https://creativecommons.org/licenses/by/4.0/ | en_GB |
dcterms.dateAccepted | 2023-08-10 | |
dcterms.dateSubmitted | 2022-10-04 | |
rioxxterms.version | VoR | en_GB |
rioxxterms.licenseref.startdate | 2023-08-10 | |
rioxxterms.type | Journal Article/Review | en_GB |
refterms.dateFCD | 2023-08-17T15:19:04Z | |
refterms.versionFCD | AM | |
refterms.dateFOA | 2023-09-28T14:31:54Z | |
refterms.panel | C | en_GB |
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Except where otherwise noted, this item's licence is described as © The Author(s) 2023. Open Access. This article is licensed under a Creative Commons Attribution 4.0 International License,
which permits use, sharing, adaptation, distribution and reproduction in any medium or format, as long
as you give appropriate credit to the original author(s) and the source, provide a link to the Creative Com mons licence, and indicate if changes were made. The images or other third party material in this article
are included in the article’s Creative Commons licence, unless indicated otherwise in a credit line to the
material. If material is not included in the article’s Creative Commons licence and your intended use is not
permitted by statutory regulation or exceeds the permitted use, you will need to obtain permission directly
from the copyright holder. To view a copy of this licence, visit http://creativecommons.org/licenses/by/4.0/